Deployment of ARX Models for Thermal Forecasting in Power Electronics Boards Using WBG Semiconductors

Abstract

Facing the thermal management challenges of Wide Bandgap (WBG) semiconductors, this study highlights the use of ARX parametric models, which provide accurate temperature predictions without requiring detailed understanding of component thickness disparities or material physical properties, relying solely on experimental measurements. These parametric models emerge as a reliable alternative to FEM simulations and conventional thermal models, significantly simplifying system identification while ensuring high result accuracy.