WM-300K+ wafer map [Single & Mixed]

reference paper

YOUNIS, H., RATTROUT, A., & YOUNIS, M. (2024). DEEP NEURAL NETWORKS FOR EFFICIENT CLASSIFICATION OF SINGLE AND MIXED DEFECT PATTERNS IN SILICON WAFER MANUFACTURING. Journal of Theoretical and Applied Information Technology, 102(3).‏

A cleaned, balanced dataset for wafer maps with 427,539 wafer maps the input is a tensor for an RGB wafer image with a dimension of 56 x 56 the output is an encoded-hot- shot as a tensor of the shape of 1 x 36